显影机设备/Developer

显影机设备/Developer

has completed independent research and development of wet process development equipment for CF, Array, TP and other sizes from G2.5 to G8.6 and above

Applicable processCF、Array、TP等

Applicable substrate sizeAll Size

Applicable substrate thickness≥0.3mm

Development typeMulti-angle Oscilation Type Shower / Dip

Equipment typeI Type,U Type,Line Type,Custom Made

Process indicators

1.High Uniformity Ultra-low Pressure Spray; 

2.Excellent Process Reliability,High CD Uniformity; 

3.Defoaming Management; 

4.No Mist, No Roller Mark, No Contamination And No Scratch; 

5.Low Running Cost。

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